Modern Electron has an immediate opening for an experienced Microfabricated Device Packaging Engineer. This Engineer will develop the processes to integrate our microfabricated devices into our thermionic power generation products. 

In this role, you will be responsible for developing device integration methods that meet specifications in regards to device performance, reliability and cost. You will simulate and test device integration methods, taking into account mechanical, thermal, and electrical requirements for all operational conditions. You will also develop and nurture collaborative vendor relationships to evaluate established and novel methods that can be scaled for high-volume production. You will play a key role in the evaluation of next-generation designs and communicate parametric trade-offs and engineering constraints to the R&D and Engineering teams.

Modern Electron is a start-up company dedicated to generating inexpensive, modular, and reliable electricity for all. Expensive mechanical engines and turbines based on 19th-century technology still generate the majority of the power used worldwide. We seek to replace them with paper thin heat-to-electricity generators. >$20MM venture capital is committed to our vision. We have enormous potential for learning, impact, and growth in a small and collaborative team setting. We value our ability to move fast to outpace larger companies and achieve what they cannot.

RESPONSIBILITIES:

• Perform simulations to evaluate and optimize the mechanical, thermal, and electrical performance of design and process concepts
• Design test vehicles and experiments to validate the performance and reliability of proposed designs and methods
• Develop and document capabilities and limitations of selected device integration methods
• Develop and manage vendor relations that ensure the design and methods can be scaled for high volume production
• Partner with the R&D and Engineering teams to ensure the design and methods meet all requirements
• Partner with the R&D and Engineering teams to evaluate whether next-generation architectures are feasible

ESSENTIAL SKILLS, KNOWLEDGE, AND ABILITIES:

• Broad understanding of design and manufacturing aspects of die attach processes and applications
• Familiarity with electronic package design and processes like thick- and thin-film metallization, electrodeposition, electroless deposition, pick and place equipment, ceramic substrates, electrical interconnects, bonding methods, etc. 
• Knowledge of mechanical, electrical, and thermal engineering design and processes associated with electronics packaging
• Ability to translate technical requirements into simulations and experiments that validate and optimize the performance of a design and method
• Detailed knowledge of some or all of the following: optical microscopy, electron microscopy (e.g., SEM), EDS, mechanical cross-sections, electrical test tools, electrical debugging and analysis, and other package-level failure analysis techniques
• Demonstrated success as an engineering team member in the development, design, testing, and production of a microfabricated device that was integrated in a product for industrial and/or commercial applications
• Experience developing material specifications for contract assemblers and raw material vendors
• Some understanding of product development and engineering project management
• Impeccable written and verbal communication
• Ability and enthusiasm to work as part of a highly collaborative, dynamic, and diverse team

MINIMUM QUALIFICATIONS:

• Bachelor’s Degree in Mechanical, Electrical, or Systems Engineering
• 5+ years of design and development experience with die attach packages for MOSFET, wide bandgap, power electronics, sensor, or MEMS applications

PREFERRED QUALIFICATIONS:

• Master’s Degree in Mechanical, Electrical, or Materials Engineering
• 3+ years experience in a startup environment
• Experience with 3D chip layout/stacks, TSV’s and interconnects.
• Experience working with semiconductor foundries.
• Solid state power and high temperature electronics industry experience

We are an equal opportunity employer
Other associated titles: Microfabricated Device Integration Engineer; R&D Packaging Engineer; Advanced Packaging Engineer