Process Engineer Sr. Director

Who We Are

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future. 

What We Offer

Salary:

Location:

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

Key Responsibilities:

• Package Architecture and DTCO (design technology co-optimization)
• Silicon and packaging process development
• Technology qualification and bring-up
• HVM supply chain development working with partners and internal teams

Requirements:

• 10+ experience in hardware and silicon-package development bringing products to market.  Experienced in Heterogeneous Integration, Process and Design Enablement
• Strong knowledge and experience in Advanced Packaging 2.5D/3D/Fan-out/EMIB/SIP processes, design trade-offs and qualification.
• Strong Knowledge in Technology and Supply Chain, Design for Reliability.
• Experience/Exposure to board assembly process is a plus
• Vendor and Project Management: Work with 3rd party partners to bring technology from concept to HVM
• CAD: Exposure and familiarity with mechanical design tools such as SolidWorks, Creo is a plus
• FEA: Work with Mechanical and Thermal Design partners
• Industrial experience: 10+ Years' experience in Advanced Packaging product and process development and deployment
• Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.

Lab Skills:

• Experience with Design of Experiments, instrumentation, optical characterization, data acquisition and analysis, including uncertainty analysis. 
• Understanding on mechanical and process characterization tools such as Optical inspection, Shadow Moire’, DIC, FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM

Academic Credentials:

(candidates must have the following qualifications for consideration)

• Master’s or a Ph.D. in Physics, Electrical Engineering, Mechanical Engineering or related field AND 10+ years of (post college) work experience in Advanced Packaging technology and product bring-up role

Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license.  Furthermore, since the role entails work on a US government funded project, the successful candidate must also be able to meet the government’s requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval.    The government’s requirements include certain restrictions on nationality and association/affiliation with entities deemed to be of concern.

Additional Information

Time Type:

Employee Type:

Travel:

Relocation Eligible:

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.