New College Grad - Advanced Packaging Technology Development Engineer - APTD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are seeking a highly motivated New College Graduate (NCG) to join the Advanced Packaging Technology Development (APTD) organization as an Advanced Packaging Engineer with a Computer Science, Computer Engineering, or Data Science background.

This role focuses on applying software, data analytics, modeling, and automation to enable next generation advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and heterogeneous integration. The engineer will work closely with packaging, process, equipment, and various cross functional teams to improve design efficiency, yield, quality, reliability, and time to market through data driven solutions.

Responsibilities:

• Develop and apply data analytics, modeling, and automation solutions to support advanced packaging technology development, qualification, and ramp activities.
• Analyze large, multi‑source datasets (process, metrology, yield, reliability, FA/RMA) to identify trends, correlations, and improvement opportunities in advanced packaging flows.
• Build and maintain scripts, dashboards, models, or ML workflows to enable packaging health monitoring, yield learning, and process optimization.
• Collaborate cross‑functionally with package design, process development, equipment, materials, manufacturing, and quality teams to translate packaging problems into computational or data‑driven solutions.
• Support root cause analysis (RCA) for package defects, yield excursions, and customer returns using statistical, analytical, and visualization techniques.
• Enable traceability, automation, and digital workflows across packaging development and NPI processes.
• Contribute to documentation, methodology development, and best‑practice sharing within the Advanced Packaging organization.
• *Note: Role and Responsibilities may change according to business needs

Required Qualifications

• BS or MS in Computer Science, Computer Engineering, Data Science, or a closely related field.  Candidates must have completed a Bachelor’s or Master’s degree within the past two years.
• Strong foundation in programming and data analysis (e.g., Python, SQL, MATLAB, R, or equivalent).
• Knowledge of statistics, data mining, machine learning, or optimization techniques.
• Ability to work with complex technical problems and translate physical or process challenges into analytical models.
• Strong communication skills and ability to collaborate across multidisciplinary engineering teams.

Preferred Qualifications

• Exposure to semiconductor manufacturing, advanced packaging, or hardware systems, through coursework, research, or internships.
• Experience with data visualization, dashboards, or workflow automation.
• Familiarity with modeling, simulation, or AI/ML applications in engineering or manufacturing environments.
• Understanding of yield analysis, process control, or reliability data (academic or internship experience acceptable).
• Interest in HBM, 2.5D/3D packaging, hybrid bonding, or heterogeneous integration technologies.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. 
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  [email protected] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

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