High-Speed Electro-Optical IC Engineer (RFIC Engineering)

HIGH-SPEED ELECTRO-OPTICAL IC ENGINEER (RFIC ENGINEERING) 

RESPONSIBILITIES: 

• Design, analyze and simulate drivers for MZM and laser diodes
• Design analyze and simulate TIAs and derive models for PDs (Ge Photo diodes)
• Derive specifications for the entire electro-optical system and circuits
• Design and model package for elecrto-optical components and systems
• Develop Analog/Mixed-Signal/RF/Microwave circuits in SiGe, FDSOI, or silicon bulk CMOS processes
• Work with system architects, DSP/ASIC designers and PIC designers to partition functions between hardware, software, and optical domains
• Perform IC floor planning and layout
• Simulate and model package and external discrete components
• Evaluate, characterize and measure electrical and optical building blocks of a high-speed optical link solution
• Assist in the development of automated test setups and test programs for production and lab measurements
• Work with manufacturing engineers on production testing and qualification of the EIC/PIC components and systems

BASIC QUALIFICATIONS: 

• Bachelor's degree in electrical engineering, computer engineering, or computer science 
• 2+ years of photonics or electro-optical integrated circuit design

PREFERRED SKILLS AND EXPERIENCE: 

• Master's degree or PhD in physics, electrical engineering or computer engineering with an emphasis in electro-optics integrated circuit design
• Experience using simulation tools such as Spectre, ADS, HFSS or Momentum, Ansys Lumerical, COMSOL
• Understanding of silicon photonics designs, and familiarity with optical building blocks such as MZM and Microring modulators, Ge Photo diodes, dWDM filters, waveguides, couplers, dividers and polarization management circuitry
• Electrical circuit design skills for mmWave or broadband analog, and experience performing analysis and simulation of both linear and non-linear circuits such as high bandwidth modulator drivers, TIAs, CTLEs, filters, low noise and power amplifiers
• Knowledge of advanced packaging technology for high-speed data links
• Experience working on wideband circuit designs supporting high speed Serdes links with more than 80Gbps data rate and bandwidths exceeding 10s of GHz
• Familiarity with high speed SerDes architecture, modulation schemes such as NRZ and PAM4 and link protocols
• Familiarity with optical and radio related test equipment such as spectrum analyzers, vector signal analyzers, vector signal generators, high speed oscilloscopes and BERTs
• Experience characterizing EIC/PIC performance for high speed optical Serdes
• Fluency with programming in either C/C++ or Python

ADDITIONAL REQUIREMENTS:  

• Ability to work long hours and weekends as necessary to support critical milestones
• This role can be based in Palo Alto, CA or Redmond, WA

COMPENSATION AND BENEFITS:
Pay Range:
Level 1: $125,000.00 - $165,000.00
Level 2: $145,000.00 - $200,000.00

Your actual level and base salary will be determined on a case-by-case basis and may vary based on the following considerations: job-related knowledge and skills, education, and experience.

Base salary is just one part of your total rewards package at SpaceX. You may also be eligible for long-term incentives, in the form of company stock or long-term cash awards, as well as potential discretionary bonuses and the ability to purchase additional stock at a discount through an Employee Stock Purchase Plan. You will also receive access to comprehensive medical, vision, and dental coverage, access to a 401(k) retirement plan, short and long-term disability insurance, life insurance, paid parental leave, and various other discounts and perks. You may also accrue 3 weeks of paid vacation and will be eligible for 10 or more paid holidays per year. Employees in Washington State accrue paid sick time in compliance with state and federal law. Company shuttles are offered to employees for roundtrip travel from select Seattle locations to the SpaceX Redmond office Monday to Friday.