The Cryomechanical team enables Microsoft Quantum’s hardware roadmap by designing, integrating, and sustaining cryogenic mechanical systems, packaging solutions, and laboratory infrastructure that support reliable experimentation, scalable system integration, and disciplined transition from research concepts to producible hardware.
At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum.
As a Senior Mechanical Designer – Cryomechanical Systems You will own products from cradle to grave, working hands on to oversee initial builds, incorporating customer feedback to make improvements and driving continuous improvements to equipment as the state-of-the-art advances. You help shape requirements, create complete three-dimensional (3D) models from scratch, produce two-dimensional (2D) drawings, document Bill of Materials (BOM), create standard operating procedures (SOPs) and work hands on in installations to guide products through their entire lifecycle.
Microsoft’s culture is grounded in a growth mindset, customer obsession, diversity and inclusion, one Microsoft collaboration, and making a difference through technology. In this role, you will be expected to model these values by learning continuously, partnering across disciplines, communicating clearly, and creating an inclusive environment where rigorous engineering and shared accountability help the team deliver meaningful impact.
Responsibilities
Own end-to-end three-dimensional (3D) computer-aided design (CAD) for cryogenic subassemblies and top-level mechanical integrations, including cold fingers, millikelvin (mK) and 4 kelvin (4 K) stages, radiation shields, vacuum interfaces, and cable or harness routing fixtures; create fully detailed two-dimensional (2D) drawings with geometric dimensioning and tolerancing (GD&T) and tolerance stackups.
Build and steward the top assembly and bill of materials (BOM) by managing part numbering, configurations, engineering change order (ECO) and engineering change request (ECR) workflows, and product data management/product lifecycle management (PDM/PLM) toolchains such as SolidWorks, Windchill, and OnePDM.
Lead Cryomechanical Engineering (CryoME) design reviews using standard review packages that include three-dimensional (3D) computer-aided design (CAD), two-dimensional (2D) drawings, critical-to-function specifications, materials, coatings, finishes, incoming quality control (IQC), cryogenic screening plans, manufacturing and assembly flows, risks, and schedules.
Translate system requirements into mechanical specifications for thermal anchoring, heat-load budgets, coefficient of thermal expansion (CTE) mismatch management, vacuum sealing, vibration isolation, radio frequency (RF) and direct current (DC) cable management, and integration across temperature stages.
Create SOPs by making detailed work instructions for installing parts, recording key data during installation and making sure that engineering intent is effectively communicated to engineers and technicians in the field.
Drive design for manufacturing/design for excellence (DFM/DFX) with suppliers by generating clear build packages, supporting fabrication through first-article approval, dispositioning nonconformances with data-driven tolerance and fit assessments, and capturing as-built changes in drawings and bills of materials (BOMs).
Embody our Culture and Values.
Qualifications
Required Qualifications
- Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position
- OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment
- OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment
- OR equivalent experience.
Other Requirements
- Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
- Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications
- Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
- OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience
- OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience
- OR equivalent experience
- CAD skills (Creo preferred): proven record creating complete 3D models from scratch and releasing production‑grade drawings.
- Deep experience in mechanical design skills – Proficiency driving complex designs involving mechanisms, multipart assemblies, commercial off-the-shelf (COTS) and custom component trade studies, and design for manufacturing and assembly (DFM/DFA) practices.
- PDM/PLM proficiency for configuration control and BOM accuracy (Windchill, OnePDM or similar).
- Design review leadership and clear documentation practices (review packages, checklists, risks, decisions, and release artifacts) per standardized, rigorous processes.
- Leadership and mentoring – Experience leading complex mechanical design efforts that require coordination across multiple contributors. Ability to assign work based on team members’ skill levels, provide appropriate technical guidance and mentoring, and maintain accountability for successful delivery.
- 5+ year of experience integrating hardware inside dilution refrigerators across temperature stages, including millikelvin (mK) through 300 kelvin (K), thermal modeling or anchoring, and harnessing for radio frequency (RF) or direct current (DC) lines.
- 5+ year of experience using finite element analysis (FEA) or thermal simulation tools such as ANSYS Mechanical or COMSOL to guide design choices or validate the integrity of designs.
- 5+ year of hands-on cryogenic, vacuum, or ultra-high vacuum (UHV) hardware experience, including materials, coatings, finishes for cryogenic service, vacuum seals, thermal interfaces, wiring fixtures, or low-outgassing practices.
- 5+ year of experience partnering with suppliers or manufacturing teams to support precision machining, sheet metal, special processes, cleaning, vacuum bakeouts, cryogenic-compatible finishes, or first-article builds.
- 5+ years of experience operating within regulated or high-security lab environments and collaborating across distributed teams or sites.
- Experience contributing to inclusive, cross-disciplinary engineering teams by communicating decisions clearly, inviting diverse perspectives, and helping create an environment where team members can contribute effectively and succeed.
- 5+ Years Documenting, dispositioning and providing corrective action for hardware non-conformances.
- Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation).
- Ability to work in an "AI-first" environment using modern AI tools to accelerate discovery through hardware development.
#Quantum #QuantumCareers #MDQCareers
Quantum Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.
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