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Top Tech Jobs & Startup Jobs in Seattle, WA
Hardware • Manufacturing
Lead and scale accounting operations (AP, AR, payroll accounting, fixed assets, accruals, reconciliations, and close). Improve close cycle, strengthen internal controls, drive ERP/process automation, build a high-performing global team, and manage auditors, consultants, and outsourced partners to support rapid growth and public-company readiness.
Hardware • Manufacturing
Own Tenstorrent's developer platform including firmware, system software, packaging, updates, and a unified CLI. Define roadmap, prioritize engineering work, partner with DevRel and customers, ship iterative improvements, and measure success via developer NPS and CLI adoption.
Top Skills:
CliCompilersDriversFirmwareOpen SourcePackagingRisc-VRuntimesTelemetry
Hardware • Manufacturing
Design and implement full‑custom analog/mixed‑signal layouts for high‑performance IP in advanced FinFET nodes. Translate schematics to manufacturable layouts, optimize floorplans for PPA and matching, run and close physical verification (DRC/LVS/ERC/DFM/antenna), perform post‑layout extraction/simulation, and integrate blocks into SoCs. Develop layout automation and collaborate with circuit designers to meet performance, noise, and reliability targets.
Top Skills:
AssuraCadence Virtuoso (Xl/Gxl)Drc/Lvs/Erc/Dfm FlowsEm/Ir AnalysisFinfet (TsmcPcellsPerlPvsPythonR/C ExtractionSamsung; 12Nm–2Nm)Siemens CalibreSkillSynopsys Custom CompilerSynopsys IcvTcl
Hardware • Manufacturing
Build and operate AI inference deployments, write production code, debug full inference stack, collaborate with customers and engineering, and drive performance/observability improvements using Kubernetes, Helm, and LLM serving tools.
Top Skills:
DynamoGrafanaHelmKubernetesLmcacheMooncakeNimOpentelemetryPrometheusRisc-VSglangVllm
Hardware • Manufacturing
Lead as a hybrid Chief of Staff and execution-focused TPM for the RISC-V software org: define goals, plan and track execution, manage dependencies and risks, drive cross-functional initiatives, support headcount and recruiting, prepare leadership materials, and represent the team to partners and customers.
Top Skills:
CompilersEngineering InfrastructureRisc-VSemiconductorsSoftware DeliverySystems Software
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Hardware • Manufacturing
Define and own chiplet-based compute platform architectures for high-performance RISC-V CPUs in SiP solutions. Lead design of PCIe, die-to-die connectivity, coherent fabrics, system management, and confidential computing subsystems. Collaborate with architecture, hardware, software, and external IP partners to deliver production-ready chiplet architectures and drive cross-functional execution.
Top Skills:
AtsBootChi-C2CChipletCoherent FabricsConfidential ComputingCxl.MemDebugDie-To-Die ConnectivityIommuMsiPci Express Root ComplexPciePower ManagementPriRciepResetRisc-VSocSystem ManagementSystem-In-PackageTee-I/OVirtualization
Hardware • Manufacturing
Design board-level routing studies, mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Collaborate with signal integrity, power integrity, mechanical, and system teams to develop PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling. Apply engineering judgment to evaluate tradeoffs and improve workflows using automation and data analytics.
Top Skills:
2.5D PackagingBackside Power DeliveryBgaCadence Allegro Pcb DesignerChipletsIntegrated Voltage RegulatorsOff-Package MemoryOn-Package MemoryPackage Embedded PassivesPackage-Board Co-DesignPcb RoutingPower IntegritySignal Integrity
Hardware • Manufacturing
Design and specify next-generation CPU networking for datacenter and automotive/robotics targets. Work at the intersection of NoC, performance modeling, and RTL to guide architecture, collaborate with hardware, software, and systems teams, and contribute to datacenter networking and early-stage automotive/robotics networking scoping and specifications.
Top Skills:
Broadcom SueDie-To-Die InterfacesEthernetInfinibandNocNvlinkRdmaRisc-VRoceRtlUalink
Hardware • Manufacturing
The CPU Core Unit Lead will develop next-generation CPU RTL, define microarchitecture specifications, oversee design quality, mentor junior engineers, and use AI tools to enhance design processes.
Top Skills:
Ai ToolsRisc-VRtlVerilogVhdl
Hardware • Manufacturing
Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.
Top Skills:
AdcAmplifiersBias GeneratorsCtleDacDdrDe-EmphasisDfeDie-To-Die Chiplet PhyEda ToolsFinfetLdoOscillatorsPciePllRxSerdesSwitched-Cap CircuitsTxUsb
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