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The engineer will define and implement ASIC package architecture, focusing on FC-BGA and MCM solutions, collaborating on package design and ensuring successful production of high-performance ASICs.

The role involves leading ASIC package design for FC-BGA and MCM solutions, ensuring high-performance mixed-signal/digital SoCs succeed from architecture to production. Responsibilities include trade studies, design standards, and vendor collaboration.

The Senior ASIC Physical Design Engineer will oversee the full physical design flow for complex SoCs, ensuring timing closure and optimization while collaborating with various teams and external providers on satellite projects.

Lead the implementation of complex SoCs for satellite systems, managing the RTL-to-GDSII flow, collaborating with design teams, and ensuring silicon success in advanced technologies.